贝格斯 Liqui-Bond SA 1800
Liqui-Bond SA1800可供规格:
规格(Specifications): 30CC 600CC 0.85gallon 5gallon
导热系数(Thermal Conductivity): 1.8W/m-k
颜色(Color): 黑色
持续使用温度(Continous Use Temp): -60°~200°
密度(Density): 2.8 g/cc
Liqui-Bond SA 1800是一种高性能、液体硅橡胶胶粘剂,固化成固体粘弹性体。所提供的粘合剂为一一部分的液体成分,提供在一个管或中等大小的容器中。
Liqui-Bond SA 1800功能相结合的高导热性和低粘度可以减轻屏幕或模板的应用。这种材料也是理想的高容量的自动模式分配。Liqui-Bond SA 1800的低粘度使材料达到一个非常薄的胶层,生产优良的热性能和较高的抗剪强度。
Liqui-Bond SA 1800的轻度的弹性性能,协助缓解热循环过程中的热膨胀系数的应力。材料固化在升高的温度和需要冷藏在10°C.Liqui-Bond SA 1800可提供可选的玻璃珠提供一个一致的立场,确保介质的完整性
典型的应用包括:印刷电路板组装. 分立元件的散热器
性能:
Property
|
Imperial Value
|
Metric Value
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Test Method
|
Color
|
Black
|
Black
|
Visual
|
Viscosity (cps) (1)
|
125,000
|
125,000
|
ASTM D2196
|
Density (g/cc)
|
2.8
|
2.8
|
ASTM D792
|
Shelf Life @ 10oC (months)
|
6
|
6
|
***
|
Property As Cured - Physical
|
Hardness (Shore A)
|
80
|
80
|
ASTM D2240
|
Continuous Use Temp (oF)/(oC)
|
-76 to 392
|
-60 to 200
|
***
|
Shear Strength (psi) / (MPa)
|
200
|
1.4
|
ASTM D1002
|
Property As Cured - Electrical
|
Dielectric Strength (V/mil) / (V/mm)
|
250
|
10,000
|
ASTM D149
|
Dielectric Constant (1000 Hz)
|
6.0
|
6.0
|
ASTM D150
|
Volume Resistivity (Ohm-meter)
|
1011
|
1011
|
ASTM D257
|
Flame Rating
|
V-O
|
V-O
|
U.L. 94
|
Property As Cured - Thermal
|
Thermal Conductivity (W/m-K)
|
1.8
|
1.8
|
ASTM D5470
|
Cure Schedule
|
Pot Life @ 25oC (hours) (2)
|
10
|
10
|
***
|
Cure @ 125oC (minutes) (3)
|
20
|
20
|
***
|
Cure @ 150oC (minutes) (3)
|
10
|
10
|
***
|
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25oC.
2) Based on 1/8" diameter bead.
3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
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